Transversely-excited film bulk acoustic resonator with etched conductor patterns

ABSTRACT

An acoustic resonator is fabricated by forming a patterned first photoresist mask on a piezoelectric plate at locations of a desired interdigital transducer (IDT) pattern. An etch-stop layer is then deposited on the plate and first photoresist mask. The first photoresist mask is removed to remove parts of the etch-stop and expose the plate. An IDT conductor material is deposited on the etch stop and the exposed plate. A patterned second photoresist mask is then formed on the conductor material at locations of the IDT pattern. The conductor material is then etched over and to the etch-stop to form the IDT pattern which has interleaved fingers on a diaphragm to span a substrate cavity. A portion of the plate and the etch-stop form the diaphragm. The etch-stop and photoresist mask are impervious to this etch. The second photoresist mask is removed to leave the IDT pattern.

RELATED APPLICATION INFORMATION

This patent claims priority to copending U.S. provisional patentapplication No. 63/019,749, titled ETCH STOP LAYER TO ENABLE DEP-ETCH OFIDTS, filed May 4, 2020.

NOTICE OF COPYRIGHTS AND TRADE DRESS

A portion of the disclosure of this patent document contains materialwhich is subject to copyright protection. This patent document may showand/or describe matter which is or may become trade dress of the owner.The copyright and trade dress owner has no objection to the facsimilereproduction by anyone of the patent disclosure as it appears in thePatent and Trademark Office patent files or records, but otherwisereserves all copyright and trade dress rights whatsoever.

BACKGROUND Field

This disclosure relates to radio frequency filters using acoustic waveresonators, and specifically to filters for use in communicationsequipment.

Description of the Related Art

A radio frequency (RF) filter is a two-port device configured to passsome frequencies and to stop other frequencies, where “pass” meanstransmit with relatively low signal loss and “stop” means block orsubstantially attenuate. The range of frequencies passed by a filter isreferred to as the “pass-band” of the filter. The range of frequenciesstopped by such a filter is referred to as the “stop-band” of thefilter. A typical RF filter has at least one pass-band and at least onestop-band. Specific requirements on a passband or stop-band depend onthe specific application. For example, a “pass-band” may be defined as afrequency range where the insertion loss of a filter is better than adefined value such as 1 dB, 2 dB, or 3 dB. A “stop-band” may be definedas a frequency range where the rejection of a filter is greater than adefined value such as 20 dB, 30 dB, 40 dB, or greater depending onapplication.

RF filters are used in communications systems where information istransmitted over wireless links. For example, RF filters may be found inthe RF front-ends of cellular base stations, mobile telephone andcomputing devices, satellite transceivers and ground stations, IoT(Internet of Things) devices, laptop computers and tablets, fixed pointradio links, and other communications systems. RF filters are also usedin radar and electronic and information warfare systems.

RF filters typically require many design trade-offs to achieve, for eachspecific application, the best compromise between performance parameterssuch as insertion loss, rejection, isolation, power handling, linearity,size and cost. Specific design and manufacturing methods andenhancements can benefit simultaneously one or several of theserequirements.

Performance enhancements to the RF filters in a wireless system can havebroad impact to system performance. Improvements in RF filters can beleveraged to provide system performance improvements such as larger cellsize, longer battery life, higher data rates, greater network capacity,lower cost, enhanced security, higher reliability, etc. Theseimprovements can be realized at many levels of the wireless system bothseparately and in combination, for example at the RF module, RFtransceiver, mobile or fixed sub-system, or network levels.

The desire for wider communication channel bandwidths will inevitablylead to the use of higher frequency communications bands. The currentLTE™ (Long Term Evolution) specification defines frequency bands from3.3 GHz to 5.9 GHz. These bands are not presently used. Future proposalsfor wireless communications include millimeter wave communication bandswith frequencies up to 28 GHz.

High performance RF filters for present communication systems commonlyincorporate acoustic wave resonators including surface acoustic wave(SAW) resonators, bulk acoustic wave (BAW) resonators, film bulkacoustic wave resonators (FBAR), and other types of acoustic resonators.However, these existing technologies are not well-suited for use at thehigher frequencies proposed for future communications networks.

DESCRIPTION OF THE DRAWINGS

FIG. 1 includes a schematic plan view and two schematic cross-sectionalviews of a transversely-excited film bulk acoustic resonator (XBAR).

FIG. 2 is an expanded schematic cross-sectional view of a portion of anXBAR with an etch-stop layer.

FIG. 3 is an expanded schematic cross-sectional view of a portion ofanother XBAR with an etch-stop layer.

FIG. 4 is a graphic illustrating a shear horizontal acoustic mode in anXBAR.

FIG. 5 is a schematic block diagram of a filter using XBARs.

FIG. 6 is a flow chart of a process for fabricating an XBAR.

FIG. 7A and FIG. 7B are collectively a flow chart of a process forforming a conductor pattern using dry etching and an etch-stop layer.

FIG. 8A and FIG. 8B are collectively a flow chart of another process forforming a conductor pattern using dry etching and an etch-stop layer.

Throughout this description, elements appearing in figures are assignedthree-digit or four-digit reference designators, where the two leastsignificant digits are specific to the element and the one or two mostsignificant digit is the figure number where the element is firstintroduced. An element that is not described in conjunction with afigure may be presumed to have the same characteristics and function asa previously-described element having the same reference designator.

DETAILED DESCRIPTION Description of Apparatus

FIG. 1 shows a simplified schematic top view and orthogonalcross-sectional views of a transversely-excited film bulk acousticresonator (XBAR) 100. XBAR resonators such as the resonator 100 may beused in a variety of RF filters including band-reject filters, band-passfilters, duplexers, and multiplexers. XBARs are particularly suited foruse in filters for communications bands with frequencies above 3 GHz.

The XBAR 100 is made up of a thin film conductor pattern formed on asurface of a piezoelectric plate 110 having parallel front and backsurfaces 112, 114, respectively. The piezoelectric plate is a thinsingle-crystal layer of a piezoelectric material such as lithiumniobate, lithium tantalate, lanthanum gallium silicate, gallium nitride,or aluminum nitride. The piezoelectric plate is cut such that theorientation of the X, Y, and Z crystalline axes with respect to thefront and back surfaces is known and consistent. In the examplespresented in this patent, the piezoelectric plates are Z-cut, which isto say the Z axis is normal to the front and back surfaces 112, 114.However, XBARs may be fabricated on piezoelectric plates with othercrystallographic orientations.

The back surface 114 of the piezoelectric plate 110 is attached to asurface of the substrate 120 except for a portion of the piezoelectricplate 110 that forms a diaphragm 115 spanning a cavity 140 formed in thesubstrate. The portion of the piezoelectric plate that spans the cavityis referred to herein as the “diaphragm” 115 due to its physicalresemblance to the diaphragm of a microphone. As shown in FIG. 1, thediaphragm 115 is contiguous with the rest of the piezoelectric plate 110around all of a perimeter 145 of the cavity 140. In this context,“contiguous” means “continuously connected without any interveningitem”.

The substrate 120 provides mechanical support to the piezoelectric plate110. The substrate 120 may be, for example, silicon, sapphire, quartz,or some other material or combination of materials. The back surface 114of the piezoelectric plate 110 may be bonded to the substrate 120 usinga wafer bonding process. Alternatively, the piezoelectric plate 110 maybe grown on the substrate 120 or attached to the substrate in some othermanner. The piezoelectric plate 110 may be attached directly to thesubstrate or may be attached to the substrate 120 via one or moreintermediate material layers.

“Cavity” has its conventional meaning of “an empty space within a solidbody.” The cavity 140 may be a hole completely through the substrate 120(as shown in Section A-A and Section B-B) or a recess in the substrate120. The cavity 140 may be formed, for example, by etching a portion ofthe substrate 120 to form a separate cavity for a resonator, before orafter the piezoelectric plate 110 and the substrate 120 are attached.This etch may be selective by having a chemistry to etch the material ofthe substrate but not the material piezoelectric plate.

The conductor pattern of the XBAR 100 includes an interdigitaltransducer (IDT) 130. The IDT 130 includes a first plurality of parallelfingers, such as finger 136, extending from a first busbar 132 and asecond plurality of fingers extending from a second busbar 134. Thefirst and second pluralities of parallel fingers are interleaved. Theinterleaved fingers overlap for a distance AP, commonly referred to asthe “aperture” of the IDT. The center-to-center distance L between theoutermost fingers of the IDT 130 is the “length” of the IDT.

The first and second busbars 132, 134 serve as the terminals of the XBAR100. A radio frequency or microwave signal applied between the twobusbars 132, 134 of the IDT 130 excites a primary acoustic mode withinthe piezoelectric plate 110. As will be discussed in further detail, theprimary acoustic mode is a bulk shear mode where acoustic energypropagates along a direction substantially orthogonal to the surface ofthe piezoelectric plate 110, which is also normal, or transverse, to thedirection of the electric field created by the IDT fingers. Thus, theXBAR is considered a transversely-excited film bulk wave resonator.

The IDT 130 is positioned on the piezoelectric plate 110 such that atleast the fingers of the IDT 130 are disposed on the portion 115 of thepiezoelectric plate that spans, or is suspended over, the cavity 140. Asshown in FIG. 1, the cavity 140 has a rectangular shape with an extentgreater than the aperture AP and length L of the IDT 130. A cavity of anXBAR may have a different shape, such as a regular or irregular polygon.The cavity of an XBAR may more or fewer than four sides, which may bestraight or curved.

For ease of presentation in FIG. 1, the geometric pitch and width of theIDT fingers is greatly exaggerated with respect to the length (dimensionL) and aperture (dimension AP) of the XBAR. A typical XBAR has more thanten parallel fingers in the IDT 110. An XBAR may have hundreds, possiblythousands, of parallel fingers in the IDT 110. Similarly, the thicknessof the fingers in the cross-sectional views is greatly exaggerated.

FIG. 2 is an expanded schematic cross-sectional view of a portion ofanother XBAR device 200 including an etch-stop layer. The piezoelectricplate 110 is a single-crystal layer of piezoelectrical material having athickness ts. ts may be, for example, 100 nm to 1500 nm.

The width of XBAR IDT fingers may be 500 nm or greater. The thickness tmof the IDT fingers may be from 100 nm to about equal to the width w. Thethickness of the busbars (132, 134 in FIG. 1) of the IDT may be the sameas, or greater than, the thickness tm of the IDT fingers.

FIG. 2 also shows two IDT fingers 236, 238 formed on the piezoelectricplate 110 which is a portion of the diaphragm of the XBAR device 200.Traditionally, the IDT fingers, such as the fingers 236, 238, and otherconductors of an XBAR device have been formed using a lift-offphotolithography process. Photoresist is deposited over thepiezoelectric plate and patterned to define the conductor pattern. TheIDT conductor layer and, optionally, one or more other layers aredeposited in sequence over the surface of the piezoelectric plate. Thephotoresist may then be removed, which removes, or lifts off, the excessmaterial, leaving the conductor pattern including the IDT fingers. Usinga lift-off process does not expose the surface 112 of the piezoelectricplate to reactive chemicals. However, it may be difficult to control thesidewall angle of conductors formed using a lift-off process.

In the XBAR device 200, the IDT fingers 236, 238 are formed using asubtractive or etching process that may provide good control ofconductor sidewall angles. One or more metal layers are deposited insequence over the surface of the piezoelectric plate. The excess metalis then be removed by an anisotropic etch through the conductor layerwhere it is not protected by a patterned photoresist. The conductorlayer can be etched, for example, by anisotropic plasma etching,reactive ion etching, wet chemical etching, and other etching technique.

To protect the surface 112 of the piezoelectric plate 110 from beingdamaged by the process and chemicals used to etch the conductor layers,the XBAR device 200 includes an etch-stop layer 210 formed on thesurface 112 of the piezoelectric plate 110. In FIG. 2, the etch stoplayer 210 is shown between but not under the IDT fingers 236, 238. Theetch-stop layer 210 may be formed over the entire surface of thepiezoelectric plate except under all of the IDT fingers. Alternatively,the etch-stop layer 210 may be formed over the entire surface of thepiezoelectric plate except under all conductors.

The etch-stop layer 210 protects the front surface 112 of thepiezoelectric plate 110 from the etch process. To this end, theetch-stop layer 210 must be impervious to the etch process or be etchedmagnitudes slower than the conductor by the etch process. The words“impervious to” have several definitions including “not affected by” and“not allowing etching or to pass through”. Both of these definitionsapply to the etch-stop layer 210. The etch-stop layer is not materiallyaffected by the etch process and does not allow the liquid or gaseousetchant used in the etch process to penetrate to the piezoelectric plate110. The etch-stop layer need not be inert with respect to the etchantbut must be highly resistant to the etchant such that a substantialportion of the thickness of the etch stop layer remains after completionof the conductor etch. The remaining etch stop layer 210 is not removedafter the IDT fingers 236, 238 and other conductors are formed andbecomes a portion of the diaphragm of the XBAR device 200.

The etch-stop layer 210 is formed from an etch-stop material. Theetch-stop material must be a dielectric with very low electricalconductivity and low acoustic loss. The etch-stop material must havehigh adhesion to the surface 112 on which it is deposited. Mostimportantly, the etch-stop material must be impervious, as previouslydefined, to the processes and chemicals used to etch the conductors.Alternatively, the etch-stop material must be etched magnitudes slowerthan the conductor by the processes and chemicals used to etch theconductors. In some cases, a viable etch stop material must withstandthe chemistry used to etch IDT material. A material chosen for etch stoppurposes may be either etchable with chemistry that does not etch thepiezoelectric plate, or be a material that does not degrade theperformance of the resonator(s). Suitable etch-stop materials mayinclude oxides such as aluminum oxide and silicon dioxide, sapphire,nitrides including silicon nitride, aluminum nitride, and boron nitride,silicon carbide, and diamond. In some cases, it is an etch stop metaloxide layer.

The XBAR device 200 may include one or more additional dielectric layersthat are shown in FIG. 2. A front side dielectric layer 220 may beformed over the IDTs of some (e.g., selected ones) of the XBAR devicesin a filter. The “front side” of the XBAR is, by definition, the surfacefacing away from the substrate. The front-side dielectric layer 220 hasa thickness tfd. The front-side dielectric layer 220 may be formedbetween the IDT fingers 226 and 228. In FIG. 2, the front sidedielectric 220 covers the IDT finger 238 but not the IDT finger 236. Ina filter, the front side dielectric may be formed over all of thefingers of some XBAR devices. For example, a front side dielectric layermay be formed over the IDTs of shunt resonators to lower the resonancefrequencies of the shunt resonators with respect to the resonancefrequencies of series resonators. Some filters may include two or moredifferent thicknesses of front side dielectric over various resonators.A back-side dielectric layer (not shown) may optionally be formed on theback side of the piezoelectric plate 110.

Further, a passivation layer 230 may be formed over the entire surfaceof the XBAR device 200 except for contact pads where electricconnections are made to circuity external to the XBAR device. Thepassivation layer is a thin dielectric layer intended to seal andprotect the surfaces of the XBAR device while the XBAR device isincorporated into a package. The front side dielectric layer 220,backside dielectric and the passivation layer 230 may each be, SiO₂,Si₃N₄, Al₂O₃, some other dielectric material, or a combination of thesematerials.

Thickness tp may be a thickness that is selected to protect thepiezoelectric plate and the metal electrodes from water and chemicalcorrosion, particularly for power durability purposes. The typical layerthickness tp may range from 10 to 100 nm. The passivation material mayconsist of multiple oxide and/or nitride coatings such as SiO₂ and Si₃N₄material.

Examples of thickness tes include between 10 to 30 nm. Thickness tes maybe a thickness that is selected to ensure that the etch-stop layercannot be etched completely through by the etch process used to etch theconductor material that forms the IDT.

FIG. 3 is an expanded schematic cross-sectional view of a portion ofanother XBAR device 300 including an etch-stop layer. FIG. 3 shows twoIDT fingers 236, 238 formed on a piezoelectric plate 110 which is aportion of the diaphragm of the XBAR device 300. The exception of theetch-stop layer 310, all of the elements of the XBAR device 300 have thesame function and characteristics as the corresponding element of theXBAR device 200 of FIG. 2. Descriptions of these elements will not berepeated.

The XBAR device 300 differs from the XBAR device 200 in that the etchstop layer 310 extends over the entire surface 112 of the piezoelectricplate 110 including under the IDT fingers 236, 238. The etch-stop layer310 may be formed over the entire surface of the piezoelectric plateincluding under all of the conductors including the IDT fingers. Theetch-stop layer 310 is an etch-stop material as previously described.

FIG. 4 is a graphical illustration of the primary acoustic mode ofinterest in an XBAR. FIG. 4 shows a small portion of an XBAR 400including a piezoelectric plate 410 and three interleaved IDT fingers430. An RF voltage is applied to the interleaved fingers 430. Thisvoltage creates a time-varying electric field between the fingers. Thedirection of the electric field is lateral, or parallel to the surfaceof the piezoelectric plate 410, as indicated by the arrows labeled“electric field”. Due to the high dielectric constant of thepiezoelectric plate, the electric field is highly concentrated in theplate relative to the air. The lateral electric field introduces sheardeformation, and thus strongly excites a primary shear-mode acousticmode, in the piezoelectric plate 410. In this context, “sheardeformation” is defined as deformation in which parallel planes in amaterial remain parallel and maintain a constant distance whiletranslating relative to each other. A “shear acoustic mode” is definedas an acoustic vibration mode in a medium that results in sheardeformation of the medium. The shear deformations in the XBAR 400 arerepresented by the curves 460, with the adjacent small arrows providinga schematic indication of the direction and magnitude of atomic motion.The degree of atomic motion, as well as the thickness of thepiezoelectric plate 410, have been greatly exaggerated for ease ofvisualization. While the atomic motions are predominantly lateral (i.e.horizontal as shown in FIG. 4), the direction of acoustic energy flow ofthe excited primary shear acoustic mode is substantially orthogonal tothe surface of the piezoelectric plate, as indicated by the arrow 465.

An acoustic resonator based on shear acoustic wave resonances canachieve better performance than current state-of-the artfilm-bulk-acoustic-resonators (FBAR) and solidly-mounted-resonatorbulk-acoustic-wave (SMR BAW) devices where the electric field is appliedin the thickness direction. In such devices, the acoustic mode iscompressive with atomic motions and the direction of acoustic energyflow in the thickness direction. In addition, the piezoelectric couplingfor shear wave XBAR resonances can be high (>20%) compared to otheracoustic resonators. High piezoelectric coupling enables the design andimplementation of microwave and millimeter-wave filters with appreciablebandwidth.

FIG. 5 is a schematic circuit diagram and layout for a high frequencyband-pass filter 500 using XBARs. The filter 500 has a conventionalladder filter architecture including three series resonators 510A, 510B,510C and two shunt resonators 520A, 520B. The three series resonators510A, 510B, and 510C are connected in series between a first port and asecond port. In FIG. 5, the first and second ports are labeled “In” and“Out”, respectively. However, the filter 500 is bidirectional and eitherport and serve as the input or output of the filter. The two shuntresonators 520A, 520B are connected from nodes between the seriesresonators to ground. All the shunt resonators and series resonators areXBARs.

The three series resonators 510A, B, C and the two shunt resonators520A, B of the filter 500 are formed on a single plate 530 ofpiezoelectric material bonded to a silicon substrate (not visible). Eachresonator includes a respective IDT (not shown), with at least thefingers of the IDT disposed over a cavity in the substrate. In this andsimilar contexts, the term “respective” means “relating things each toeach”, which is to say with a one-to-one correspondence. In FIG. 5, thecavities are illustrated schematically as the dashed rectangles (such asthe rectangle 535). In this example, each IDT is disposed over arespective cavity. In other filters, the IDTs of two or more resonatorsmay be disposed over a single cavity.

Description of Methods

FIG. 6 is a simplified flow chart showing a process 600 for making anXBAR or a filter incorporating XBARs. The process 600 starts at 605 witha substrate 120 and a plate of piezoelectric material 110 and ends at695 with a completed XBAR or filter. The flow chart of FIG. 6 includesonly major process steps. Various conventional process steps (e.g.surface preparation, chemical mechanical processing (CMP), cleaning,inspection, baking, annealing, monitoring, testing, etc.) may beperformed before, between, after, and during the steps shown in FIG. 6.

The flow chart of FIG. 6 captures three variations of the process 600for making an XBAR which differ in when and how cavities are formed inthe substrate 120. The cavities may be formed at steps 610A, 610B, or610C. Only one of these steps is performed in each of the threevariations of the process 600.

The piezoelectric plate 110 may be, for example, Z-cut lithium niobateor lithium tantalate as used in the previously presented examples. Thepiezoelectric plate may be some other material and/or some other cut.The substrate may preferably be silicon. The substrate may be some othermaterial that allows formation of deep cavities by etching or otherprocessing.

In one variation of the process 600, one or more cavities are formed inthe substrate 120 at 610A, before the piezoelectric plate is bonded tothe substrate at 620. A separate cavity may be formed for each resonatorin a filter device. The one or more cavities may be formed usingconventional photolithographic and etching techniques. These techniquesmay be isotropic or anisotropic. Typically, the cavities formed at 610Awill not penetrate through the substrate.

At 620, the piezoelectric plate 110 is bonded to the substrate 120. Thepiezoelectric plate and the substrate may be bonded by a wafer bondingprocess. Typically, the mating surfaces of the substrate and thepiezoelectric plate are highly polished. One or more layers ofintermediate materials, such as an oxide or metal, may be formed ordeposited on the mating surface of one or both of the piezoelectricplate and the substrate. One or both mating surfaces may be activatedusing, for example, a plasma process. The mating surfaces may then bepressed together with considerable force to establish molecular bondsbetween the piezoelectric plate and the substrate or intermediatematerial layers.

A conductor pattern, including IDTs of each XBAR, is formed at 630 bydepositing and patterning one or more conductor layer on the front sideof the piezoelectric plate. Alternative techniques to form the conductorpattern will be discuss subsequently with respect to FIG. 7 and FIG. 8.In some cases, forming at 630 occurs prior to bonding at 620, such aswhere the IDT's are formed prior to bonding the plate to the substrate.

At 640, a front-side dielectric layer or layers may be formed bydepositing one or more layers of dielectric material on the front sideof the piezoelectric plate, over one or more desired conductor patternsof IDT or XBAR devices. The one or more dielectric layers may bedeposited using a conventional deposition technique such as sputtering,evaporation, or chemical vapor deposition. The one or more dielectriclayers may be deposited over the entire surface of the piezoelectricplate, including on top of the conductor pattern. Alternatively, one ormore lithography processes (using photomasks) may be used to limit thedeposition of the dielectric layers to selected areas of thepiezoelectric plate, such as only between the interleaved fingers of theIDTs. Masks may also be used to allow deposition of differentthicknesses of dielectric materials on different portions of thepiezoelectric plate. In some cases, depositing at 640 includesdepositing a first thickness of at least one dielectric layer over thefront-side surface of selected IDTs, but no dielectric or a secondthickness less than the first thickness of at least one dielectric overthe other IDTs. An alternative is where these dielectric layers are onlybetween the interleaved fingers of the IDTs.

In a second variation of the process 600, one or more cavities areformed in the back side of the substrate 120 at 610B. A separate cavitymay be formed for each resonator in a filter device. The one or morecavities may be formed using an anisotropic or orientation-dependent dryor wet etch to open holes through the back-side of the substrate to thepiezoelectric plate. In this case, the resulting resonator devices willhave a cross-section as shown in FIG. 1.

In a third variation of the process 600, one or more cavities in theform of recesses in the substrate 120 may be formed at 610C by etchingthe front side of the substrate using an etchant introduced throughopenings in the piezoelectric plate. A separate cavity may be formed foreach resonator in a filter device.

In all variations of the process 600, the filter or XBAR device iscompleted at 660. Actions that may occur at 660 include depositing anencapsulation/passivation layer such as SiO₂ or Si₃O₄ over all or aportion of the device; forming bonding pads or solder bumps or othermeans for making connection between the device and external circuitry;excising individual devices from a wafer containing multiple devices;other packaging steps; and testing. After the filter device iscompleted, the process ends at 695. FIGS. 2 and 3 may show examples ofthe fingers of selected IDTs after completion at 660.

FIG. 7A and FIG. 7B are collectively a flow chart of a process 700 forforming a conductor pattern using dry etching and an etch-stop layer.The process 700 is or is included in the forming of conductor patternsat 630 of process 600. Process 700 is a subtractive or etching processthat provides good control of conductor sidewall angles for theconductor pattern (e.g., of the IDT and/or fingers herein).

The process 700 starts at 720 with a plate of piezoelectric material 712and ends at 750 with a completed XBAR conductor pattern 746 formed onthe piezoelectric material plate 712. Piezoelectric plate 712 at 720 maybe any of plates 110 and/or 410. The completed XBAR conductor pattern746 on the plate at 750 may be a conductor pattern that is or thatincludes the IDT patterns and/or fingers described herein for XBARdevices.

The flow chart of FIG. 7 includes only major process steps. Variousconventional process steps (e.g. surface preparation, chemicalmechanical processing (CMP), cleaning, inspection, baking, annealing,monitoring, testing, etc.) may be performed before, between, after, andduring the steps shown in FIG. 7.

At 720 a first patterned photoresist mask 722 is formed overpiezoelectric plate 712. The photoresist mask 722 may be a patternedlithography mask that is formed over areas of the piezoelectric plate712 where the etch stop layer is not desired. These may be areas orlocations where the desired conductor pattern of the IDT or fingers areto be formed. The photoresist mask 722 may be deposited over thepiezoelectric plate and patterned to define the conductor pattern wherethe photoresist mask 722 exists after patterning.

At 725 an etch stop material 726 is deposited over the over thepiezoelectric plate 712 and over the photoresist mask 722. The etch stopmaterial 726 may be blanket deposited over all of the exposed topsurfaces of the plate and mask to form an etch-stop layer. Thisetch-stop layer may include the etch stop material in the pattern ofetch-stop layer 210 as well as etch stop material on the photoresistmask 722. The etch stop material 726 may be a material and/or bedeposited as described for etch-stop layer 210.

At 730 the first photoresist mask 722 is removed. At 730 the photoresistmask 722 may then be removed, which removes, or lifts off, the etch stopmaterial 726 which was deposited on the photoresist mask 722, thusleaving the pattern of etch-stop layer 210 on the piezoelectric plate712. The first photoresist mask 722 is removed using a process that doesnot expose the surface of the piezoelectric plate 712 to reactivechemicals or a process that will damage or etch the piezoelectric plate712.

At 735 IDT conductor material 736 is deposited over the etch stopmaterial 724 and over the piezoelectric plate 712 where the firstphotoresist mask 722 was removed. The conductor material may be anelectronically conductive material and/or material used to form aconductor pattern as noted herein. Depositing at 735 may be blanketdepositing one or more metal layers in sequence over the top surfaces ofthe etch stop material 724 and the exposed piezoelectric plate 712. TheIDT conductor material 736 may be blanket deposited over all of theexposed top surfaces of the etch-stop layer 724 and of the piezoelectricplate 712.

At 740 a patterned second photoresist mask 742 is formed over the IDTconductor material 736. The photoresist mask 742 may be a patternedlithography mask that is formed over areas of the IDT conductor material736 where the IDT conductor material 746 is desired. These may be areasor locations where the desired conductor pattern of the IDT or fingersare to be formed. The photoresist mask 742 may be blanket deposited overthe IDT conductor material 736 and then patterned to define theconductor pattern 746 where the photoresist mask 742 exists afterpatterning.

The patterned second photoresist mask 742 may function like an etch stopin that it will be impervious to and/or be etch magnitudes slower thanthe conductor material by the processes and chemicals used to etch theconductor material 736. Suitable photoresist materials may includeoxides such as a light sensitive material, a light-sensitive organicmaterial (e.g., a photopolymeric, photodecomposing, or photocrosslinkingphotoresist), an oxide or a nitride.

At 745 IDT conductor material 736 is dry etched and removed by ananisotropic etch through the conductor where it is not protected by thesecond photoresist mask 742, thus forming conductor pattern 746. Theconductor layer 736 can be etched, for example, by an anisotropic plasmaetching, reactive ion etching, wet chemical etching, and other etchingtechniques. The etch may be a highly anisotropic, high-energy etchprocess that can damage (via chemical etch or physical sputtering) thepiezoelectric layer where that layer is exposed to the etch.

The dry etch etches or removes the conductor over and to the etch stopmaterial 724. Both, the second photoresist mask 742 and the etch stopmaterial 724 are impervious, as previously defined, to the processes andchemicals used to etch the conductors. Alternatively, they are etchedmagnitudes slower than the conductor material by the processes andchemicals used to etch the conductors. Thus, this anisotropic etch doesnot remove the conductor material 736 under the second photoresist mask742 and does not remove the etch stop material 724 since they areimpervious and/or etched magnitudes slower. The conductor material 736remaining under the second photoresist mask 742 and on the piezoelectricplate 712 is the conductor pattern desired for the IDT and/or fingers.

At 750 the second photoresist mask 742 is removed from the top surfaceof the conductor material 736. This leaves the pattern of desiredconductor material 746 deposited directly onto the piezoelectric plate712 and the etch stop material 724 between but not under the conductormaterial. The second photoresist mask 742 is removed using a processthat does not expose the surface of the conductor to reactive chemicalsor a process that will damage or etch the conductor material 746.

After removing at 750, the remaining desired conductor material 76 maybe or include the IDT conductor and/or fingers described herein. It maybe the conductor material in the XBAR device 200, such as the IDTfingers 236, 238. The remaining etch stop material 724 may be or beinclude etch stop layer 210.

FIG. 8A and FIG. 8B are collectively a flow chart of another process 800for forming a conductor pattern using dry etching and an etch-stoplayer. The process 800 is or is included in the forming of conductorpatterns at 630 of process 600. Process 800 is a subtractive or etchingprocess that provides good control of conductor sidewall angles for theconductor pattern (e.g., of the IDT and/or fingers herein).

The process 800 starts at 825 with a plate of piezoelectric material 812and ends at 850 with a completed XBAR conductor pattern 846 formed onthe piezoelectric material plate 812. Piezoelectric plate 812 at 825 maybe any of plates 110 and/or 410. The completed XBAR conductor pattern846 on the plate at 850 may be a conductor pattern that is or thatincludes the IDT patterns and/or fingers described herein for XBARdevices.

The flow chart of FIG. 8 includes only major process steps. Variousconventional process steps (e.g. surface preparation, chemicalmechanical processing (CMP), cleaning, inspection, baking, annealing,monitoring, testing, etc.) may be performed before, between, after, andduring the steps shown in FIG. 8.

At 825 an etch stop material 824 is deposited over the over thepiezoelectric plate 812. The etch stop material 824 may be blanketdeposited over all of the exposed top surfaces of the plate to form anetch-stop layer. The etch stop material 824 may be a material and/or bedeposited as described for etch-stop layer 210.

At 835 IDT conductor material 836 is deposited over the etch stopmaterial 824. The IDT conductor material 836 may be blanket depositedover all of the exposed top surfaces of the etch-stop layer. Depositingat 835 may be depositing one or more metal layers in sequence over thetop surfaces of the etch stop material 824.

At 840 a patterned photoresist mask 842 is formed over the IDT conductormaterial 836. The photoresist mask 842 may be a patterned lithographymask that is formed over areas of the IDT conductor material 836 wherethe IDT conductor material 846 is desired. These may be areas orlocations where the conductor pattern of the IDT or fingers are to beformed. The photoresist mask 842 may be blanket deposited over the IDTconductor material 836 and then patterned to define the conductorpattern 846 where the photoresist mask 842 exists after patterning.

The patterned photoresist mask 842 may function like an etch stop inthat it will be impervious to and/or be etch magnitudes slower than theconductor material by the processes and chemicals used to etch theconductor material 836. Suitable photoresist materials may includeoxides such as a light sensitive material, a light-sensitive organicmaterial (e.g., a photopolymeric, photodecomposing, or photocrosslinkingphotoresist), an oxide or a nitride.

At 845 IDT conductor material 836 is dry etched and removed by ananisotropic etch through the conductor where it is not protected by thephotoresist mask 842, thus forming conductor pattern 846. The conductorlayer 836 can be etched, for example, by an anisotropic plasma etching,reactive ion etching, wet chemical etching, and other etchingtechniques. The etch may be a highly anisotropic, high-energy etchprocess that can damage (via chemical etch or physical sputtering) thepiezoelectric layer where that layer is exposed to the etch.

The dry etch etches or removes the conductor over and to the etch stopmaterial 824. Both, the photoresist mask 842 and the etch stop material824 are impervious, as previously defined, to the processes andchemicals used to etch the conductors. Alternatively, they are etchedmagnitudes slower than the conductor material by the processes andchemicals used to etch the conductors. Thus, this anisotropic etch doesnot remove the conductor material 836 under the second photoresist mask842 and does not remove the etch stop material 824 since they areimpervious and/or etched magnitudes slower. The conductor material 836remaining under the second photoresist mask 842 and on the etch stopmaterial 824 is the conductor pattern desired for the IDT and/orfingers.

At 850 the photoresist mask 842 is removed from the top surface of theconductor material 836. This leaves the pattern of desired conductormaterial 846 deposited directly onto the etch stop material 824 betweenand under the conductor material 846. The photoresist mask 842 isremoved using a process that does not expose the surface of theconductor material 846 to reactive chemicals or a process that willdamage or etch the conductor material 846.

After removing at 850, the remaining desired conductor material 846 maybe or include the IDT conductor and/or fingers described herein. It maybe the conductor material in the XBAR device 300, such as the IDTfingers 336 and 338. The remaining etch stop material 824 may be or beinclude etch stop layer 310.

Using the subtractive or etching of each of processes 700 and 800provides better control of conductor sidewall angles of the desiredconductor material than a lift-off process. In some cases, processes 700and 800 provide a predefined deposit-etched IDT with sharp sidewallangles by using a highly anisotropic, high-energy etch process that maydamage (via chemical etch or physical sputtering) the piezoelectriclayer, and by protecting the piezoelectric layer with a thin layer ofinsulating etch stop metal oxide layer that is deposited over it. Byusing the highly anisotropic, high-energy etch process and etch stoplayer the processes 700 and 800 allow for better resolution of the IDTsas well as sharper vertical wall angle of the IDTs.

Closing Comments

Throughout this description, the embodiments and examples shown shouldbe considered as exemplars, rather than limitations on the apparatus andprocedures disclosed or claimed. Although many of the examples presentedherein involve specific combinations of method acts or system elements,it should be understood that those acts and those elements may becombined in other ways to accomplish the same objectives. With regard toflowcharts, additional and fewer steps may be taken, and the steps asshown may be combined or further refined to achieve the methodsdescribed herein. Acts, elements and features discussed only inconnection with one embodiment are not intended to be excluded from asimilar role in other embodiments.

As used herein, “plurality” means two or more. As used herein, a “set”of items may include one or more of such items. As used herein, whetherin the written description or the claims, the terms “comprising”,“including”, “carrying”, “having”, “containing”, “involving”, and thelike are to be understood to be open-ended, i.e., to mean including butnot limited to. Only the transitional phrases “consisting of” and“consisting essentially of”, respectively, are closed or semi-closedtransitional phrases with respect to claims. Use of ordinal terms suchas “first”, “second”, “third”, etc., in the claims to modify a claimelement does not by itself connote any priority, precedence, or order ofone claim element over another or the temporal order in which acts of amethod are performed, but are used merely as labels to distinguish oneclaim element having a certain name from another element having a samename (but for use of the ordinal term) to distinguish the claimelements. As used herein, “and/or” means that the listed items arealternatives, but the alternatives also include any combination of thelisted items.

It is claimed:
 1. An acoustic resonator device comprising: a substratehaving a surface; a single-crystal piezoelectric plate having front andback surfaces, the back surface of the piezoelectric plate bonded to afront surface of the substrate; an interdigital transducer (IDT) formedon the front surface of the single-crystal piezoelectric plate, the IDThaving interleaved fingers disposed on a diaphragm spanning a cavity inthe substrate; and an etch-stop layer formed on the front surface of thepiezoelectric plate between the interleaved fingers, a portion of thepiezoelectric plate and the etch-stop layer forming the diaphragm,wherein the etch-stop layer is impervious to an etch process used toform the interleaved fingers.
 2. The device of claim 1, wherein theetch-stop layer is formed on the front surface of the piezoelectricplate between but not under the interleaved fingers,
 3. The device ofclaim 1, wherein the etch-stop layer is formed on the front surface ofthe piezoelectric plate between and under the interleaved fingers, 4.The device of claim 1, wherein the single-crystal piezoelectric plate isone of lithium niobate and lithium tantalate; and wherein the etch-stoplayer is one of an oxide, sapphire, a nitride, silicon carbide, anddiamond.
 5. The device of claim 4, wherein the etch-stop layer isaluminum oxide.
 6. The device of claim 4, wherein the etch-stop layer isa high thermal conductivity material selected from aluminum nitride,boron nitride, and diamond.
 7. The device of claim 1, furthercomprising: a front-side dielectric layer on the etch stop layer and onthe interleaved fingers, wherein the diaphragm includes thepiezoelectric plate, the front-side dielectric layer, and the etch-stoplayer.
 8. The device of claim 7, wherein the front-side dielectric layeris SiO₂, Si₃N₄, or Al₂O₃.
 9. The device of claim 7, further comprising:passivation layer over the front-side dielectric layer.
 10. The deviceof claim 1, wherein the IDT and piezoelectric plate are configured suchthat a radio frequency signal applied to the IDT excites a shear primaryacoustic mode within the piezoelectric plate, and wherein a direction ofacoustic energy flow of the shear primary acoustic mode is substantiallyorthogonal to the front and back surfaces of the single-crystalpiezoelectric plate.
 11. A filter device, comprising: a substrate havinga front surface; a single-crystal piezoelectric plate having front andback surfaces, the back surface of the piezoelectric plate bonded to thefront surface of the substrate; a conductor pattern formed on the frontsurface of the piezoelectric plate, the conductor pattern including aplurality of interdigital transducers (IDTs) of a respective pluralityof acoustic resonators including a shunt resonator and a seriesresonator, interleaved fingers of each of the plurality of IDTs disposedon a respective diaphragm of one or more diaphragms spanning respectivecavities in the substrate; an etch-stop layer formed on the frontsurface of the piezoelectric plate between interleaved fingers of theIDTs, portions of the single-crystal piezoelectric plate and theetch-stop layer forming the one or more diaphragms, wherein theetch-stop layer is impervious to an etch process used to form theinterleaved fingers.
 12. The filter device of claim 11, furthercomprising: a frequency setting dielectric layer disposed on a frontsurface of the etch-stop layer between the interleaved fingers of theIDT of the shunt resonator.
 13. The filter device of claim 12, whereinthe frequency setting dielectric layer is a first dielectric layer thathas a first thickness that is greater than a second thickness of asecond dielectric layer deposited between the fingers of the IDT of theseries resonator, a resonance frequency of the shunt resonator is set,at least in part, by the first thickness, and a resonance frequency ofthe series resonator is set, at least in part, by the second thickness.14. The filter device of claim 11, wherein the etch-stop layer is formedon the front surface of the piezoelectric plate between but not underthe interleaved fingers.
 15. The filter device of claim 11, wherein theetch-stop layer is formed on the front surface of the piezoelectricplate between and under the interleaved fingers.
 16. A filter device,comprising: a substrate having a front surface; a piezoelectric platehaving front and back surfaces, the back surface of the piezoelectricplate coupled to the front surface of the substrate; a conductor patternof a conductor material formed over the front surface of thepiezoelectric plate, the conductor pattern including a plurality ofinterdigital transducers (IDTs) of a respective plurality of acousticresonators including at least one shunt resonator and at least seriesresonator, interleaved fingers of each of the plurality of IDTs disposedon a respective diaphragm of one or more diaphragms spanning respectivecavities in the substrate; an etch-stop layer formed on the frontsurface of each IDT between interleaved fingers of the IDTs, the one ormore diaphragms including portions of the single-crystal piezoelectricplate and the etch-stop layer, wherein the etch-stop layer is a materialselected to be impervious to at least one etch process capable ofetching the conductor material.
 17. The filter device of claim 16,wherein the at least one etch process is a highly anisotropic,high-energy chemical etch process or physical sputtering etch process.